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| (R) EMIF10-1K010F2 IPADTM EMI FILTER INCLUDING ESD PROTECTION MAIN PRODUCT CHARACTERISTICS: Where EMI filtering in ESD sensitive equipment is required Mobile phones and communication systems Computers, printers and MCU Boards DESCRIPTION The EMIF10-1K010F2 is a highly integrated devices designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 flip chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV. BENEFITS Flip-Chip (24 Bumps) Table 1: Order Code Part Number EMIF10-1K010F2 Marking FD EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead free package Very low PCB space consuming: 2.57 mm x 2.57 mm Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reducing of parasitic elements through integration & wafer level packaging. Figure 1: Pin Configuration (ball side) 5 I7 I9 I10 09 010 4 GND 3 GND 2 I3 I5 I4 03 04 1 A I1 I2 01 02 GND GND B C D E I8 07 08 I6 05 06 COMPLIES WITH THE FOLLOWING STANDARDS: IEC61000-4-2 Level 4 15kV (air discharge) 8kV (contact discharge) MIL STD 883E -Method 3015-6 Class 3 Figure 2: Basic Cell Configuration Low-pass Filter Input Output Ri/o = 1k Cline = 100pF GND GND GND TM: IPAD is a trademark of STMicroelectronics. October 2004 REV. 1 1/7 EMIF10-1K010F2 Table 2: Absolute Maximum Ratings (Tamb = 25C) Symbol Tj Top Tstg Parameter and test conditions Junction temperature Operating temperature range Storage temperature range Value 125 - 40 to + 85 - 55 to + 150 Unit C C C Table 3: Electrical Characteristics (Tamb = 25C) Symbol VBR IRM VRM VCL Rd IPP RI/O Cin Symbol VBR IRM RI/O Rline At 0V bias IR = 1 mA VRM = 3V per line 900 80 1000 100 Parameters Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between Input & Output Input capacitance per line IPP VCL VBR VRM IRM IR I V Test conditions Min. 6 Typ. 8 Max. 10 500 1100 120 Unit V nA pF Figure 3: S21 (dB) attenuation measurement and Aplac simulation 0.00 dB - 5.00 Figure 4: Analog crosstalk measurements 0 Aplac - 10.00 -20 -40 -60 -80 Measure - 15.00 - 20.00 - 25.00 - 30.00 - 35.00 - 40.00 - 45.00 - 50.00 1.0M 3.0M 10.0M 30.0M f/Hz 100.0M 300.0M 1.0G -100 1 10 100 frequency (MHz) 1,000 2/7 EMIF10-1K010F2 Figure 5: Digital crosstalk measurement Figure 6: ESD response to IEC61000-4-2 (+15kV air disc.harge) on one input V(in) and on one output (Vout) VG1 V(in1) V(out1) 2 1 G1 V Figure 7: ESD response to IEC61000-4-2 (-15kV air discharge) on one input V(in) and on one output (Vout) Figure 8: Line capacitance versus applied voltage C(pF) 100 90 80 70 60 50 40 30 20 10 0 F=1MHz Vosc=30mV V(in1) V(out1) VR(V) 1 2 5 10 3/7 EMIF10-1K010F2 Figure 9: Aplac model single line structure GNDi Rs Ls 50pH 50m Ii Oi 50pH 50m Ls Rs + Port15 - 50 Rgnd Lgnd + cap_line cap_line + Port16 50 Lbump Rbump Rgnd Lgnd Rgnd Lgnd Rgnd Lgnd Rseries Ii Oi Ii MODEL = demif10 GNDi MODEL = demif10 Oi Csubump Rsubump + cap_hole Lhole + sub Rsub Rhole Csubump Rsubump + sub Figure 10: Aplac model parameters Cz Rseries cap_line Ls Rbump Lbump Rs Csubump Rsubump Rsub lhole Rhole cap_hole Rgnd Ignd 57pF 960 0.8pF 0.6nH 50m 50pH 0.15 15pF 0.15 0.1 1.2nH opt 0.15 0.15pF 0.25 0.4nH Model demif10 BV = 7 IBV = 1m CJO = Cz M = 0.3333 Rs = 1 VJ = 0.6 TT = 100n 4/7 EMIF10-1K010F2 Figure 11: Ordering Information Scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x = 1: 500m, Bump = 315m = 2: Leadfree Pitch = 500m, Bump = 315m = 3: Leadfree Pitch = 400m, Bump = 250m yy - xxx zz Fx Figure 12: FLIP-CHIP Package Mechanical Data 500m 50 315m 50 650m 65 500m 50 2.57mm 50m 2.57mm 50m 250m 40 Figure 13: Foot print recommendations Figure 14: Marking 545 400 Copper pad Diameter : 250m recommended , 300m max Solder stencil opening : 330m Dot, ST logo xx = marking z = packaging location yww = datecode (y = year ww = week) 545 E Solder mask opening recommendation : 340m min for 315m copper pad diameter xxz y ww 100 230 All dimensions in m 5/7 EMIF10-1K010F2 Figure 15: FLIP-CHIP Tape and Reel Specification Dot identifying Pin A1 location 4 +/- 0.1 O 1.5 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 0.73 +/- 0.05 All dimensions in mm Table 4: Ordering Information Ordering code EMIF010-1K010F2 Marking FD Package Flip-Chip Weight 9.2 mg Base qty 5000 Delivery mode Tape & reel 7" Note: More informations are available in the application notes: AN1235: "Flip-Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" 8 +/- 0.3 ST E ST ST xxz yww User direction of unreeling xxz yww xxz yww E E 4 +/- 0.1 Table 5: Revision History Date 12-Oct-2004 Revision 1 First issue Description of Changes 6/7 EMIF10-1K010F2 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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